Payment & Shipping Terms:
|SPC:||Offline SPC Support||SPC Report:||Anytime Report|
|PCB Thickness:||0.3mm~4.5mm||Power:||AC220V±10%, 50/60Hz,1200W|
|Travel Speed:||700mm/s||Repeat Ability:||<1μm@3sigma|
FPC Solder Paste Inspection Machine for Inspecting PCB,SMTfly-V850 Features:
High-precision control platform
The motion platform adopts servo motor and high-precision ball screw structure, and the motion is high-speed, smooth, vibration-free and noise-free.
High-precision grating scale with full closed loop feedback system.
High-definition, high-speed camera
Ultra-high frame rate industrial cameras with industrial lenses for extremely high shooting speeds; self-developed
RGB three-color light source, can realize 3D, 2D true color map, display effect is extremely close to real object;
Utilizing GPU massively parallel technology greatly improves the speed of operation and detection.
Ultra High Frame Rate Industrial Camera with Industrial Lens
Comprehensive and detailed SPC analysis system
SPC is the use of statistical methods for the process of the various stages of process control, through the analysis of test information feedback, to promote the improvement of the process before the process, in order to achieve the prevention of bad.
The operator can intuitively view the comprehensive statistics of test information through a pie chart or a bar chart.
Statistical information can be output in formats such as Html, Excel, or Image.
True color three-dimensional image
Phase Modulation Profilometry (PMP) is based on sinusoidal motion projection of structured gratings.
Discrete phase shift to obtain multiple illuminated object light field images, and then calculated according to multi-step phase shift method.
Out of the phase distribution, the final use of triangulation and other methods to obtain a high-precision object shape.
Contour and volume measurements. True color three-dimensional image display.
Red glue detection
This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.
Bare-board learning programming
No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.
Automatic plate bend compensation
The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.
Camera barcode recognition
The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate traceability of product quality.
Offline programming and debugging
The remote programming can be done by using offline programming software to import Gerger, CAD, etc. The programming time does not exceed 5 minutes.
Detection frame can be adjusted at any time
The size and shape of openings in some gerber files may not be exactly the same as openings in the stencil. In this case, the data (position, size, shape, etc.) of the detection frame can be manually adjusted through the learning mode.
Virtual Mark function
If there is no mark point data in the gerber file, or when the bare board is programmed, the virtual mark can be defined, and any real mark point on the PCB can be set as the detection anchor point.
FPC Solder Paste Inspection Machine for Inspecting PCB,SMTfly-V850 Specification:
|Camera||Full digital high speed CCD camera, 5 million pixels|
|Light source||Ring LED light source|
|Processing time per picture||<0.6s|
|Test content||Paste printing / red plastic printing: volume, area, height, shape, offset, continuous tin, overflow glue|
|Defect Types||Yes, Offset, Multi-Tin, Less Tin, Continuous Tin, Tip, Collapse, Alien, Gold finger, Insufficient Height, Height Exceeded, Overfill, Insufficient, etc.|
|Paste height range||10~400um|
|Paste size range||0.15mm×0.15mm~10mm×10mm|
|Height detection accuracy||1μm (based on actual solder paste and 3D correction block)|
|Repeat ability (volume/area/height)||<1μm@3sigma|
|Repeat ability & Reproduce ability||<10%|
|Operating System||Microsoft Windows XP Professional, Windows 7|
|Features||3D bidirectional raster projection head (single head optional), no shadow 3D detection|
|Operational interface||Graphical programming, easy operation, switchable English, traditional and simplified systems|
|Interface display||2D/3D color map|
|MARK||can select 2 common Mark points, multi-Mark function can be selected in the puzzle, and Bad Mark function is supported|
|Programming||Support Gerber, CAD import, support offline programming and manual programming|
|SPC Report||Anytime Report|
|Histogram/control chart||Volume,area, height, offset|
Reports (Excel), Pictures (jpg, bmp)
By the way,If you're interested in it,we'll send you the video for your reference.
Contact Person: Sales Manager