355nm UV Laser PCB Depaneling Machine10W for Separating PCB,SMTfly-LJ330

355nm UV Laser PCB Depaneling Machine10W for Separating PCB,SMTfly-LJ330 Application:

Suitable for cutting objects: FPC circuit board shape, chip cutting, mobile phone camera module.

Fragments, layers, blocks, or selected areas are cut and formed directly. The cutting edges are neat, smooth, smooth, and free of burrs. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other exterior cutting

5High-performance laser: Adopting the solid-state UV laser of the international first-line brand, it has the advantages of good beam quality, small focal spot, uniform power distribution, small thermal effect, small kerf width and high cutting quality, which guarantees perfect cutting quality.

355nm UV Laser PCB De-panel Depanelizer with 10W for Separating PCB​ Features:

1 High Accuracy: The combination of a low-drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micrometer-level accuracy.

2 easy to learn: independent research and development of Windows-based control software, easy-to-use Chinese interface, friendly and beautiful, powerful and diverse, easy to operate.

3 Intelligent Automated: Using high-precision CCD automatic positioning, focusing, positioning fast and accurate, without manual intervention, simple operation, to achieve the same type of one-button mode, greatly improve production efficiency. The galvanometer auto-calibration, auto-focusing and full automation are achieved. The laser displacement sensor is used to automatically adjust the height of the focus to the tabletop to achieve fast alignment and save time and effort.

355nm UV Laser PCB De-panel Depanelizer with 10W for Separating PCB Specification: