Customizable FPC / PCB Laser Depaneling Machine , PCB Laser Cutting Machine SMTfly-5S

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Customizable FPC / PCB Laser Depaneling Machine , PCB Laser Cutting Machine SMTfly-5S

Large Image : Customizable FPC / PCB Laser Depaneling Machine , PCB Laser Cutting Machine SMTfly-5S

Product Details:

Place of Origin:	China
Brand Name:	SMTfly
Certification:	CE ISO
Model Number:	SMTfly-5S

Payment & Shipping Terms:

Minimum Order Quantity:	1Set
Price:	USD/1Set
Packaging Details:	Wooden Box
Delivery Time:	After payment 15-30 working days

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Detailed Product Description

Repetition Precision:	±1μm	Laser Wavelength:	355nm
Platform:	Marble	Rated Power:	10W/12W/15W/17W
Material:	≤1.2mm	Diameter:	20±5μm
High Light:	pcb depaneling equipment , uv laser cutting machine

Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,SMTfly-5S Features:

High precision CCD automatic positioning, automatic focusing;
Fast and accurate positioning, save time and no worries;
Friendly interface,Simple operation, easy to use, free application;
Small size, Save more space;
rigorous security design;
Reduce energy consumption;
Cost savings;
Cost-effective, fast cutting speed,stable performance.

Advantages of Laser PCB Depaneling/Singulation Machine:

No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Application for Laser PCB Depaneling Machine:

FPC and some relative materials;
FPC/PCB/ Rigid‐Flex PCB cutting,
Camera module cutting.

Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,SMTfly-5S:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

UV Laser Cutting Machine for FPC DepanelingSpecification:

Technical Parameter	Main body of laser	148013601412
	Weight	1500KG
	Laser	355nm
	Laser	Optoware 10W (US)
	Material	≤1.2mm
	Precision	±20μm
	Platform	±2μm
	Working Area	600*450mm
	Maximum	3KW
	Vibrating	CTI(US)
	Power	AC220V
	Diameter	20±5μm
	Ambient	20±2℃
	Ambient	< 60%
	The Machine	Marble