Payment & Shipping Terms:
|Positioning Accuracy:||±2 μm||Repeat Ability:||±2 μm|
|Focus Spot Diameter:||20±5μm||Thickness:||≤ 1.2 Mm|
|Ambient Temperature:||20±2 °C||Humidity:||<60 %|
Laser PCB Depaneling Machine / FPC Laser Depaneler /UV FPC Laser Depanelizer SMTfly-LJ330 Features:
1 High Accuracy: The combination of a low-drift galvanometer and a fast ironless linear motor system platform enables fast cutting while maintaining micrometer-level accuracy.
2 easy to learn: independent research and development of Windows-based control software, easy-to-use Chinese interface, friendly and beautiful, powerful and diverse, easy to operate.
3 Intelligent Automated: Using high-precision CCD automatic positioning, focusing, positioning fast and accurate, without manual intervention, simple operation, to achieve the same type of one-button mode, greatly improve production efficiency. The galvanometer auto-calibration, auto-focusing and full automation are achieved. The laser displacement sensor is used to automatically adjust the height of the focus to the tabletop to achieve fast alignment and save time and effort.
Laser PCB Depaneling Machine / FPC Laser Depaneler /UV FPC Laser Depanelizer Specification
|Laser power supply||AC220V / 3KW|
|Laser Sources||All Solid State 355nm UV Lasers|
|Laser power||10W (customer-made or imported according to customer requirements)|
|Thickness||≤ 1.2 mm (depending on actual material)|
|Machine accuracy||±20 μm|
|Platform positioning accuracy||±2 μm|
|Platform repeat ability||±2 μm|
|Cutting web||Double Y table, single Y area 300*330mm|
|Focus spot diameter||20±5μm|
|Ambient temperature/humidity||20±2 °C/<60 %|
|Machine Tool Body||Galvo mirror system imported|
|Motion System||Full-closed AC linear motor system|
|Motion Control System||Original Import|
|Necessary hardware &software||Including PC and CAM software|
Laser PCB Depaneling Machine / FPC Laser Depaneler /UV FPC Laser Depanelizer Application:
Suitable for cutting objects: FPC circuit board shape, chip cutting, mobile phone camera module.
Fragments, layers, blocks, or selected areas are cut and formed directly. The cutting edges are neat, smooth, smooth, and free of burrs. Products can be arranged in a matrix for automatic positioning and cutting, especially for fine, difficult, complex patterns and other exterior cutting
5High-performance laser: Adopting the solid-state UV laser of the international first-line brand, it has the advantages of good beam quality, small focal spot, uniform power distribution, small thermal effect, small kerf width and high cutting quality, which guarantees perfect cutting quality.
Laser PCB Depaneling Machine / FPC Laser Depaneler /UV FPC Laser Depanelizer Description:
Neat and smooth edge, no burr or overflow;
Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.
Laser wavelength: 355nm;
Rated power: 10W/15W@30KHz;
Galvanometer working field Per One Process: 30 × 30mm;
Power consumption for the hole machine: 2KW.
Contact Person: Sales Manager